Intel B75 Chipset 2nd-3rd Gen Industrial Computer Motherboard - Stable and Durable Industrial-grade Motherboard
Technical Parameters
| Model | Motherboards supporting 2nd/3rd generation CPUs | |||
| OEM&ODM | Support customization | |||
| Product Name | KTB-781G2 | KTB-B75-6P | KTB-581G2 | KTB-B75 |
| Type | Standard ATX | Standard ATX | MIRCO ATX | PICMG 1.0 Industrial CPU Card |
| Chipset | B75 | B75 | B75 | B75 |
| CPU Socket | LGA1155 | LGA1155 | LGA1155 | LGA1155 |
| Supported CPU | 2nd/3rd Gen | 2nd/3rd Gen | 2nd/3rd Gen | 2nd/3rd Gen |
| Memory | 4*DDR3 DIMM, Max 32GB | 4*DDR3 DIMM, Max 32GB | 2*DDR3 DIMM, Max 16GB | 2*DDR3 DIMM, Max 16GB |
| Display Interface | VGA+DVI-D | VGA+DVI-D | VGA+DVI-D | VGA |
| Serial Ports | 6 | 6 | 6 | 2 |
| COM1-2: 232 | COM1-2: 232 | COM1: 232 | COM1-2: 232 | |
| COM3: 485/422/232 | COM3: 485/422/232 | COM2: 485/422/232 | ||
| COM4-6: 232 | COM4-6: 232 | COM3-6: 232 | ||
| Network Ports | 2 | 2 | 2 | 2 |
| Intel 82583V+82579L | RTL 8111E | |||
| USB | 2*USB3.0 | 2*USB3.0 | 4*USB3.0 | 8*USB2.0 |
| 10*USB2.0 | 10*USB2.0 | 7*USB2.0 or 8*USB2.0 (optional) | ||
| Hard Disk Interface | 1*SATA3.0 | 1*SATA3.0 | 1*SATA3.0 | 1*SATA3.0 |
| 5*SATA2.0 | 3*SATA2.0 | 3*SATA2.0 | 3*SATA2.0 | |
| PCIE 16X | 1*16X | 1*16X | 1*16X | / |
| PCIE 4X | 1*4X | / | 1*4X | / |
| PCIE 1X | 1*1X | / | / | / |
| PCI | 4 | 6 | 2 | / |
| PS/2 | Supported | Supported | Supported | Supported |
| LPT | Supported | Supported | Supported | Supported |
| Power Supply | ATX | ATX | ATX | ATX |
| Operating Temperature | 0℃~60℃ | 0℃~60℃ | 0℃~60℃ | 0℃~60℃ |
| Storage Temperature | -20℃~85℃ | -20℃~85℃ | -20℃~85℃ | -20℃~85℃ |
| Operating Humidity | 5%~95%, No condensation | 5%~95%, No condensation | 5%~95%, No condensation | 5%~95%, No condensation |
| OS | WinXP/7/8/10, Linux | WinXP/7/8/10, Linux | WinXP, Win7/8/10, Linux | WinXP, Win7/8/10, Linux |
| Motherboard Size | 245*305 MM | 245*305 MM | 245*245 MM | 338*122 MM |
What industrial-grade features do KTB-581G2,KTB-781G2,KTB-B75-6P,KTB-B75 possess?
01
Chipset and Processor Architecture Support
All are equipped with the Intel B75 chipset, compatible with Intel Sandy/Ivy Bridge Core i3/i5/i7 processors with LGA1155 interface, providing a stable and efficient hardware foundation for industrial-grade computing.
01
Memory Expansion Specifications
All are configured with DDRⅢ DIMM memory slots. Although there are differences in single-module capacity and maximum supported capacity, they can all meet the memory expansion needs of different data processing tasks in industrial scenarios.
01
Input/Output Interface Configuration
Equipped with diversified IO interfaces, including multiple types of USB interfaces, SATA interfaces, COM interfaces, LPT interfaces, and Gigabit Ethernet ports, adapting to the connection needs of different industrial equipment, and all supporting VGA+DVI synchronous/asynchronous dual-display function.
01
Diverse Size Options
Multiple size specifications including 338*122 MM, 245*305 MM and 245*245 MM are available, all of which can adapt to the installation space requirements of different industrial equipment, meet the diversified adaptation needs for motherboard sizes in various industrial scenarios, and provide flexible options for equipment integration.
01
Performance and Reliability Indicators
It features high-speed computing capabilities, anti-interference performance, and strong electromagnetic compatibility, ensuring stable operation in complex industrial electromagnetic environments and suitability for various industrial, military, and scientific research scenarios.
01
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Stable power supply: Industrial grade power support
Using Intersil power management chip, the output deviation is controlled within ± 1% range, which can filter out clutter signals in the power grid; The CPU adopts a 5-10 phase power supply design, with even load distribution, which can prevent single circuit overheating and ensure stable and sufficient current at full load. The fully automatic SMT precision welding process converts design parameters into stable actual performance.
02
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Pure signal: improved anti-interference ability
The 6th generation and newer motherboards are equipped with at least 10 high-quality inductors, which can absorb high-frequency interference signals and maintain current fluctuations below 5mV; Installed with an accuracy of ± 0.01mm to ensure uniform signal impedance (50 Ω± 5%), coupled with a grounding shielding layer to isolate electromagnetic interference and ensure accurate data transmission.
03
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Durable Insertion and Removal: Assisted by 15U Gold Plating Process
The key interface is treated with 15U gold plating (3 to 5 times that of consumer grade), which has anti-oxidation and anti-corrosion capabilities, can withstand more than 1000 insertions and removals, and has a contact resistance of less than 5m Ω. Laser welding strengthens the gold layer, ensures interface lifespan consistent with the motherboard, and reduces maintenance costs.
04
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Military Quality: Stable Operation in Extreme Environments
The working temperature range is wide from -20 ℃ to 70 ℃, and the memory and other components can operate at -40 ℃ when stable; The serial port pins can withstand 6KV electrostatic shock (three times higher than commercial standards), reducing the probability of breakdown. High temperature solder and weather resistant components ensure that deformation does not occur during cold and hot cycles.
05
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Wide Temperature Storage: Suitable for harsh storage and transportation environments
The storage temperature range is -20 ℃ to 85 ℃, and it can be stored for more than 12 months without power on. The component attenuation degree does not exceed 3%, solving the problem of "storage failure" caused by cross regional transportation and long-term inventory, and preventing losses caused by scrapping.
06
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High speed communication: equipped with Intel Gigabit Ethernet card
Equipped with Intel Gigabit Ethernet card, the transmission rate can reach 1000Mbps full speed, the packet loss rate is controlled below 0.001%, and the delay does not exceed 1ms. It is compatible with industrial protocols such as PROFINET to ensure efficient and stable synchronization between devices and the cloud.
07
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Strict Quality Control: No Defects in the Entire Process
All components are selected from top tier brands and have undergone three rounds of testing; The SMT production line is monitored throughout the entire process through AOI, AXI, etc. Each motherboard undergoes 48 hours of high temperature full load testing and 1000 temperature cycle tests, with ISO 9001 certification ensuring traceability.
08
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Improve after-sales service: worry free guarantee throughout the entire cycle
Provide a 1-year original factory warranty, with a 24/7 technical team responding within 15 minutes; After the product is discontinued, spare parts will continue to be supplied for 5 years, and customized upgrade services can be provided to cover the entire life cycle of the equipment, so there is no need to worry when using it.
Application Cases
The following are real application cases of KTB in various industries.

Customization: Supported

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Free Lifetime Technical Support for End-Users & Dealers

One-year limited warranty(option extended warranty services)

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